Suspect Counterfeit Materials & Packaging in the Federal Supply Chain

April 05, 2016

- NASA Ames Research Center, Moffett Field, CA

By personal invitation from NASA Ames Safety Mission & Assurance Office, Bob Vermillion, SME ESD Materials & Packaging, was invited to provide a One-Hour Mini Tutorial on Suspect Counterfeit Materials & Packaging in the Federal Supply Chain.  The conference room was filled with Federal employees, Prime Contractors, OEMs and CMs that provide products to NASA, DOD and DOE.  

​

Bob Vermillion, a renowned Subject Matter Expert in ESD Materials, Packaging and Static Control products,  has written numerous articles and white papers on the rise in Supplier Non-Compliance throughout the global supply chain. 

​

Many of these issues today can be attributed to a lack of awareness of manufacturers and end users that have always relied upon a  "Tech Data Sheet" as proof of a product's compliance to "Industry Standards."

Today, you must "Trust but Verify Your Supplier"  to insure Compliance to traceable Standards of Performance that can include ANSI/ESD, Military Standards, ASTM, IEC, JEDEC or your specific Corporate requirements.   

​

​

for Outstanding Innovations in Packaging Engineering

May 06, 2015

- Picatinny Arsenal, New Jersey

The National Institute of Packaging, Handling and Logistics Engineers (NIPHLE) consisting of the US Army, US NAVY, USMC, DLA, DCMA and Industry presented RMV Technology Group, LLC with the 2014 NIPHLE National Corporate Award for Outstanding Innovations & Contributions in the field of Packaging Engineering in support of the Warfighter.  

 Sealed Air Corporation, an Industry Leader for Packaging innovations and a Fortune 500 company,  was the prior recipient of this outstanding award.

Aerospace & Defense DVD for the revised ANSI/ESD S20.20-2014 Requirement

October 12, 2010

- Moffett Field, CA

​

On behalf of the DOD,  RMV scripted and filmed a groundbreaking DVD for ESD Workstation Practices in the handling of sensitive components and parts (including COTs).

Today, this video is still relevant due to the stricter requirements for compliance required for NASA and the DOD.  

In this workstation refresher Video, the viewer can listen to a short video (8 minutes) on the requirements  for ESD Workstations for compliance to the recently revised ANSI/ESD S20.20-2014 standard.  

Now required is "physical test data" from your Supplier or Distributor to meet the revisions for this updated document.   

​

Please contact our offices if you are interested in licensing the  DVD for Workstation Compliance in a  concise and easy to follow "Hands On" Video to insure your ESD Program is current and will meet the basic guidelines for upcoming ESD Audits or Assessments..  

ESD "Hands On" Program First for Industry & Academia

May 01, 2008

As the Industry Leader for  ESD and Packaging, Bob Vermillion is the First in Industry and Government to implement the ESD Packaging Program for Cal Poly San Luis Obispo.

First held in a crowded conference room in the School of Industrial Design, Bob's unique course offering became so popular that the Annual Cal Poly Packaging Conference featured this class as part of the program for the next few years.  Participants from Vandenberg AFB to the prime contracting community from Northern California to the borders of Mexico attending this Annual Conference on a regular basis.  

Now, Bob teaches this innovative  "Hands On" ESD and Packaging Course at UC Berkeley Space Science Laboratory and for the ONE NASA ESD Program Managers that come in from all over the country. 

Bob Vermillion, CPP, College of Fellows

May 16, 2007

COLLEGE OF FELLOWS AWARD

Bob Vermillion, President, RMV Technology Group, LLC, has been inducted into the College of Fellows by the Board of Directors of the Institute of Packaging Professionals in recognition of his special and outstanding contributions and service to the field of packaging as an individual whose knowledge, skills and conduct as a dedicated professional has truly benefited the packaging industry.

​

Institute of Packaging Professionals, Chicago, Illinois

May 16, 2002

NATIONAL AWARD FOR BEST ELECTRONIC PACKAGING DESIGN IN THE USA

​

Bob Vermillion, CEO and Founder of RMV Technology Group LLC, was thrilled to receive the top award for the most Innovative Electronics Packaging Design in the USA at a packed ceremony in the Chicago Convention Center amidst a swarm of packaging engineers from all over the country.  

RMV placed 1st in the Electronics category for his outstanding innovative and cost effective packaging design that utilized a recently developed  inherently conductive polymer that housed a very sensitive fiber optics module and 1/3 the size of the original design!   

Moreover, the outer fiberboard packaging was designed by Bob with  unique shielding  properties  embedded into the substrate ( and also developed by Mr. Vermillion) as an anticounterfeit measure for the sensitive fiberoptic module encased in the ICP vacuum formed tray.  All electrostatic materials testing was performed at the RMV  Tech Group ESD laboratory according to the ANSI/ESD Standards for ESD materials. 

Placing 2nd and 3rd in the Electronics category was awarded to Hewlett Packard with a team of over 50 packaging engineers with Motorola trailing in 4th place.   

​

​